Stable Slurry Delivery Helps Create Ultra-Flat Surfaces for Chip Manufacturing
When it comes to semiconductor manufacturing, people often think first of highly sophisticated processes such as lithography and etching. However, before these nanometer-scale circuits can be formed, there is another critical step: polishing the wafer surface to an atomic-level flatness. There is a saying within the industry: “In chip manufacturing, 30% is process technology, 70% is cleaning, and ultimate polishing determines success.” While somewhat exaggerated, it highlights the significance of cleaning and polishing. A wafer serves as the foundational substrate for semiconductor devices. After each deposition layer and wiring process,… Read More »Stable Slurry Delivery Helps Create Ultra-Flat Surfaces for Chip Manufacturing









